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According to industry sources, ASE has won a large number of Wi-Fi SoC orders from Qualcomm and MediaTek with its unique aQFN technology, and is actively seeking additional supplies of related packaging materials, including lead frames, to complete the order.

According to digitimes, sources say that aQFN technology is more cost-effective than substrate package-based solutions, so it has become mainstream Wi-Fi 6/6E SoCs from Qualcomm and MediaTek and even Wi-Fi 7 in 2023. The preferred backend technology for the product.

It is reported that ASE has started mass production of the second-generation aQFN technology at its factories in Kaohsiung in southern Taiwan and Chungli in the north, as well as its subsidiary Sipin factory in central Taiwan.

A few days ago, ASE announced that it will continue to expand its investment in Taiwan, China, spending NT$1.325 billion to cooperate with Hongjing Construction to build the second campus plant of the Zhongli Plant to expand the IC packaging and testing production line. The new plant is expected to be completed in the third quarter of 2024.